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Shenzhen DSX electronics Co., Ltd
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customized smart phone side key module hdi ultrathin 0.05mm fpc
Specification: 0.05mm thickness au plating
Detail: Place of Origin: China Base Material: FR-4 Layer: 1,2,4 and 36 layer Thickness: 0.6-2.4 mm Copper Thickness: 0.5-2OZ Solder Mask: customized like green,red,black,blue,yellow,white Min.line Width: 0.15mm Min.line ***ce: ...
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